NXP Secures EUR 1 Billion Loan from EIB for RDI NXP Semiconductors N.V. (NXP) announced that it has secured a EUR 1 billion loan from the European Investment Bank (EIB)…
Turning Down the Heat: New Discovery Fuels the Future of Electronics Researchers at the University of Virginia (UVA) have achieved a breakthrough in understanding heat flow in thin metal films, paving…
Chips Joint Undertaking Drives Europe’s Semiconductor Future The European Union is stepping into the future of technology with a bold initiative to revolutionize the semiconductor industry, specifically…
Sequans Retains Full Commercial Rights as Qualcomm Acquires 4G IoT Technology Sequans Communications, a provider of 4G and 5G semiconductor solutions for the Internet of Things (IoT) sector, and Qualcomm Incorporated,…
European Commission Backs EUR 5 Billion for New German Semiconductor Plant The European Commission has authorized EUR 5 billion in state aid for the construction and operation of a chip manufacturing…
United Kingdom Becomes Participating State in the Chips JU Program The Chips Joint Undertaking is pleased to announce the inclusion of the United Kingdom as a participating state in the…
